How to implement Frequency thermal coupling model by using thermal package description

[J.S.Hwang]

I have successfully implemented the thermal coupling effect using the thermal package description. However, we are uncertain about how to incorporate frequency-dependent modeling into the system. Because the LPF frequency varies for each device within the target power module, we believe that each device should be assigned an individual thermal path, which then passes through its respective LPF before being connected to a common case node. Nevertheless, we are unsure how to implement this structure appropriately.